| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve wettability of solder in making flip-chip connection with gold-solder connection. <P>SOLUTION: A heat treatment is performed wherein a flame 14 formed by burning mixed gas of hydrogen and dried air is irradiated to a solder 6 on a plurality of flip terminals on a package substrate 3 via a mask 12 arranged between a torch 13 and the package substrate 3 such that a surface temperature of the package substrate 3 is in the 160 to 170°C range. Subsequently, flip-chip connection is made with gold-solder connection, thereby removing organic materials (carbon and the like) attached to the top surface of the solder 6 to achieve gold-solder connection with assured wettability of the solder 6. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
