| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a favorable circuit board and a semiconductor device which are adapted to the reduction of a film by the use of a prepreg according to a circuit pattern. <P>SOLUTION: The circuit board is formed by laminating a core layer of a sheet-shaped substrate, the prepreg having a first resin layer formed on the one face side of the core layer and a second resin layer formed on the other face side thereof, and a board having circuit wiring. The first resin layer of the prepreg is jointed to a face where the circuit wiring of the board is formed, and a thickness of the first resin layer is thicker than that of the second resin layer. Furthermore, when the thickness of the first resin layer is B1 [μm], a thickness of the circuit board coming into contact with the first resin layer is t1 [μm], a copper remaining rate of the circuit wiring is S [%], and a thickness from the upper end of the circuit wiring to the core layer is t2 [μm], a relation of B1=t2+t1×(1-S/100) is satisfied. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
