发明名称 CONDUCTIVE SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive substrate in which a material of low heat resistance can be used as a base and which has practically sufficient conductivity and to provide a method for manufacturing the conductive substrate with high productivity. SOLUTION: In the manufacturing method of the conductive substrate, metal particulate dispersion liquid is printed onto the base and is calcinated. Metal particulate with an average particle size of 1 to 100 nm is dispersed in metal particulate dispersion liquid. Calcination is performed by irradiation of an electromagnetic wave of 300 MHz to 300 GHz. The conductive substrate has a conductive thin film patterned on the base. The base is formed of plastic, glass or paper. A main component of the conductive thin film is the metal and porosity is 3 to 30%. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243946(A) 申请公布日期 2008.10.09
申请号 JP20070079256 申请日期 2007.03.26
申请人 DAINIPPON PRINTING CO LTD 发明人 HOJO MIKIKO
分类号 H05K3/12;B32B15/04;H01B5/14;H01B13/00 主分类号 H05K3/12
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