发明名称 PLATE MATERIAL DIVIDING DEVICE AND PLATE MATERIAL DIVIDING METHOD
摘要 PROBLEM TO BE SOLVED: To cut and divide a plate material with a smaller load. SOLUTION: A plate material dividing device has a displaceable abutting mechanism unit 30 and a dividing force applying mechanism unit. The displaceable abutting mechanism unit 30 has a linear abutting portion 32 which can abut against one of main surfaces of the plate material 10 along an extension direction of a linear dividing line portion of the plate material 10. Then the linear abutting portion 32 is displaceable along a direction nearly perpendicular to the plate material 10 at a plurality of positions along the extension direction thereof, and energized toward the plate material 10 with energizing force corresponding to a displacement amount thereof. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244222(A) 申请公布日期 2008.10.09
申请号 JP20070083943 申请日期 2007.03.28
申请人 LASER SOLUTIONS CO LTD 发明人 HORII RYOGO
分类号 H01L21/301;B28D5/00 主分类号 H01L21/301
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