| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition which can be applied without using any solvent or hardly using any solvent, exerts a favorable cure rate when molded into a pressure-sensitive adhesive material and yields a cured product which is excellent in heat-creep resistance (retention of heat resistance) and heat-resistant adhesion, leaves no glue on an adherend when peeled off from the adherend and increasing recyclability. SOLUTION: The curable composition comprises a polyoxyalkylene polymer (A) having a reactive silicon group of the formula: -SiX<SB>3</SB>within the molecule, a polyoxyalkylene polymer (B) having a reactive silicon group of the formula: -SiR<SP>1</SP>X<SB>2</SB>within the molecule, a chelate compound (C) comprising an alkylphenol resin (C-1) and a metal oxide and/or a metal hydroxide (C-2) and a curing catalyst (D). The weight ratio ((A):(B)) of the polyoxyalkylene polymer (A) to the polyoxyalkylene polymer (B) in the curable composition is from 95:5 to 5:95. The curable composition contains 5-150 pts.wt. chelate compound (C) and 0.1-10 pts.wt. curing catalyst (D) against 100 pts.wt. total ((A)+(B)) of polyalkylene polymers. COPYRIGHT: (C)2009,JPO&INPIT
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