| 摘要 |
PROBLEM TO BE SOLVED: To install wiring for an arrangement of high density connection electrodes at a low cost. SOLUTION: A substrate 1 is a laminated substrate consisting of a surface layer 2 and inner surface layers 3 and 4 and has a first portion S1 where the inner surface layer 3 is exposed at one side end, and a second portion S2 where the surface layer 2 is laminated on the remaining portion of the inner surface layer 3. A drive circuit 12 is mounted for the second portion S2 in the vicinity of the boundary portion of the first portion S1 and the second portion S2. The wire 13B out of a plurality of wires 13A and 13B is connected with a connection electrode 11B at a part of the inner surface layer 4 on the lower surface side through a plurality of second relay electrodes 14B formed on the surface layer 2, and a conductive material filled in a through hole 15B penetrating a plurality of layers, and the remaining wire 13A is connected with the remaining connection electrode 11A through a plurality of first relay electrodes 14A formed on the inner surface layer 3, and a conductive material filled in a through hole 15A penetrating a part of the plurality of layers. COPYRIGHT: (C)2009,JPO&INPIT
|
