发明名称 LASER MACHINING APPARATUS
摘要 <p>A laser processing apparatus is provided improve productivity of workpieces by increasing the processing speed without moving a chuck table adapted to hold the workpiece. A laser processing apparatus comprises a stationary base(2), a chuck table mechanism(3), a laser beam irradiation unit support mechanism(4), and a laser beam irradiation unit(5). The chuck table mechanism is adopted to hold a workpiece that is placed on the stationary base so as to be movable in a process-transfer direction. The laser beam irradiation unit support mechanism is disposed on the stationary base so as to be movable in an indexing-transfer direction perpendicular to the process-transfer direction. The laser beam irradiation unit is disposed on the laser beam unit support mechanism. The chuck table mechanism includes a pair of guide rails(31), a first slide block(32), a second slide block(33), a cover table(35), and a chuck table(36).</p>
申请公布号 KR20080090975(A) 申请公布日期 2008.10.09
申请号 KR20080026031 申请日期 2008.03.20
申请人 DISCO CORPORATION 发明人 NOMARU KEIJI;MORIKAZU HIROSHI;SAWABE TAIKI
分类号 B23K26/00 主分类号 B23K26/00
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