发明名称 MOLDING METHOD AND MICROLENS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a molding method excellent in mold releasability and capable of obtaining a predetermined surface shape. SOLUTION: This molding method comprises a molding step of forming a molded article by closely bonding a molding material M to a mold 1 with a molding surface 16 in a predetermined shape, and a mold release step of releasing the molded article from the mold 1. The molding method also comprises a film forming step of forming a release film 18 on the molding surface 16 of the mold 1 before the molding step, and a removal step of removing the release film 18 by introducing an etching liquid E via an introducing passage provided in the mold 1 and communicating with the molding surface 16, before the mold release step. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008238634(A) 申请公布日期 2008.10.09
申请号 JP20070083694 申请日期 2007.03.28
申请人 SEIKO EPSON CORP 发明人 SAITO ATSUSHI
分类号 B29C33/56;B29C33/38;B29C33/54;B29C39/02;B29C39/26;B29C39/36;B29L11/00;G02B3/00 主分类号 B29C33/56
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