发明名称 SOLDER LIQUID LEVEL CONTROL APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solder liquid level control apparatus that can quickly supply solder for a shortage and that has excellent usability. SOLUTION: The solder liquid level control apparatus is equipped with a pair of electrodes 16 connected to a detection circuit, in a freely vertically operated manner. A driving source for the vertical operation is a servo motor 25. An encoder 24 for controllably driving the servo motor 25 is monitored, conduction when the electrodes 16 descend to come in contact with the liquid level of a solder vessel 17 is detected, thus from the value of the encoder 24 when the conduction is detected, the liquid level height of the solder vessel 17 is detected, a difference is obtained between a preset/input liquid level and the detected liquid level height. A controller 20 is provided which supplies an amount of solder 18 corresponding to this difference to the solder vessel 17 by a solder feeding means 26. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008238237(A) 申请公布日期 2008.10.09
申请号 JP20070085067 申请日期 2007.03.28
申请人 SHIN MEIWA IND CO LTD 发明人 SHIMADA MINORU;INOUE HIROYUKI
分类号 B23K3/06;B23K101/38;G01F23/24;G05D9/12 主分类号 B23K3/06
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