| 摘要 |
<p>A method of producing a semiconductor package enabling a sheet-like adhesive film to be used as it is and thereby reducing loss and enabling mounting without the piece of adhesive film sticking out from the semiconductor chip, comprising forming cutting-off notches (10a) in an adhesive film (10) provided on a support film (11) from the adhesive film (10) side down to the surface of the support film (10) or a depth (D) in the middle and cutting the adhesive film (10) to pieces of predetermined size, then stretching the support film (11) to separate the cut individual piece of the adhesive film (10), attaching semiconductor chip to the cut individual piece of the adhesive film (10), and mounting the semiconductor chip on a substrate by the piece of adhesive film (10), and an apparatus for producing a semiconductor package and adhesive film for use with that method. <IMAGE></p> |
