COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD

摘要

Disclosed is a composition for removing residues from wiring boards, which contains an oxidizing agent and an azole compound while having a pH of 1-7. Also disclosed is a method for cleaning a wiring board wherein residues are removed from a wiring board after dry etching by using such a composition. By using such a composition for removing residues, residues remaining after dry etching which are derived from the resist or metals can be effectively removed without corroding highly corrosion-prone titanium or titanium alloys during production of a wiring board. Consequently, a semiconductor device using a wiring board particularly containing titanium or a titanium alloy can be produced efficiently.