| 摘要 |
PROBLEM TO BE SOLVED: To provide a susceptor for a semiconductor manufacturing apparatus having improved uniformity in heating even if a substrate is subjected to vacuum chuck. SOLUTION: The susceptor 1 for a semiconductor manufacturing apparatus includes: a support member 3 made of aluminum nitride where a heater electrode 2 for heating a substrate is buried; a recessed wafer pocket section 4 formed on the upper surface of the support member 3; a through hole 5 formed at the wafer pocket section 4; and a seal band section 6 for supporting the substrate at the outer-periphery section of the wafer pocket section 4. A plurality of gas channels 7 capable of passing gas in a chamber from the outer periphery of the seal band section 6 to the wafer pocket section 4 are formed on the upper surface of the seal band section 6. COPYRIGHT: (C)2009,JPO&INPIT |
