Sensor for monitoring mold flux during molding of integrated circuit package on carrier element, has sensor wire provided in package, where end of sensor wire is fastened on semiconductor chip, and runs within mold compound

摘要

The sensor has a sensor wire (6) provided in an integrated chip package, where an end of the sensor wire is fastened on a semiconductor chip. The fastened end runs within a mold compound. The sensor wire consists of a material with the same dimension and characteristics like that of bonding wire connections (7). The sensor wire consists of gold, aluminum and copper. The sensor wire is fastened to a free bond pad (8) on the chip without need of electrical contacting. An independent claim is also included for a method for monitoring a mold flux during molding of an integrated circuit package.