| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure of a package comprising a substrate with a die through hole and a contact hole structure, formed penetrating the substrate. <P>SOLUTION: Terminal pads 8 are formed under contact through holes 6, and contact pads 22 are formed on the upper surface of a substrate 2. A die 16 having a micro lens area 42 is disposed in a die through hole by adhesion. Wire bonding is formed on the die and the substrate, and each bonding wire 24 is connected to the die 16 and to a contact pad 22. A protective layer 26 is formed to cover the bonding wires. A transparent cover 36 is disposed above the die in the die through hole through adhesion, to expose the microlens region. Conductive bumps are coupled to the terminal pads. <P>COPYRIGHT: (C)2009,JPO&INPIT |
