| 摘要 |
<P>PROBLEM TO BE SOLVED: To speed up a wire bonding work and improve wire bonding accuracy further. <P>SOLUTION: The introduction 21 of the image of the bonding point of a semiconductor chip 2A transferred 20 to a bonding center 50 is performed. A bonding point position recognition processing 22 is performed. Then, wire bonding 24 is performed to a corrected bonding point. The introduction 25 of an image after the bonding for the semiconductor chip 2A is performed. A next semiconductor chip 2B is transferred 30 to the bonding center 50. The introduction 31 of the image of the bonding point of the semiconductor chip 2B is performed. A bonding point position recognition processing 32 is performed. Then, a processing 26 for recognizing the shift of the position of the image of the semiconductor chip 2A after the bonding is performed while wire bonding, wire bonding 34 to the corrected bonding point, is performed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
