| 摘要 |
<P>PROBLEM TO BE SOLVED: To electrically connect objects which are arranged on both surfaces of a substrate, by allowing filling of an electroconductive material in through-holes in an easy manner. <P>SOLUTION: First, a filling channel 49 having a groove 46 and a recess 47 communicating with the groove 46 is formed on the substrate 41 (filling channel forming step). Next, the through hole 48 communicating with the groove 46 is formed (through hole forming step). Then, wiring 42 is formed on an upper surface of the substrate 41, and an individual electrode 32 is arranged on a lower surface of the substrate 41 (arranging step). Then, a droplet 51 is made to land on the recess 47, and an electroconductive liquid 52 is filled in the through hole 48 via the groove 46 (liquid filling step). Next, the liquid 52 filled in the groove 46, the recess 47, and the through hole 48 is heated to hardened (hardening step). Then, the recess 47 and the groove 46 of the substrate 41 are removed by cutting up to an area near the through hole 48 (removing step). <P>COPYRIGHT: (C)2009,JPO&INPIT |
