| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic chip component which can be surely and easily loaded on a circuit board with superior reliability and small man-hours at all times, and to provide its manufacturing method. <P>SOLUTION: A conductive adhesion layer 14 is selectively formed on each projection electrode tip face 121 of the electronic chip component 1, and a binder resin layer 141 for holding the conductive particles 142 of each conductive adhesion layer 14 is formed into the 2-layer structure of a base adhesion layer 1411 constituted of an acrylic paste material and a surface adhesion layer 1412 constituted of an epoxy resin. The conductive adhesion layer 14 of the 2-layer structure is formed by forming the base adhesion layer 1411 by applying the acrylic paste material wherein the conductive particles 142 are uniformly dispersed and mixed on the projection electrode tip face 121 by an ink jet and laminating the surface adhesion layer 1412 by applying an epoxy resin solution on it by the ink jet. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
