发明名称 HIGH FREQUENCY MODULE
摘要 PROBLEM TO BE SOLVED: To reduce an insertion loss for a route of a receiving signal in a high frequency module in which an element for outputting a receiving signal in the status of a balanced signal is mounted on the upper surface of a layered substrate and a receiving signal terminal is disposed on a bottom surface of the layered substrate. SOLUTION: A high frequency module comprises a layered substrate 200 and an element 120 for outputting a receiving signal in the status of a balanced signal. The element 120 includes output terminals T1, T2 and is mounted on an upper surface 200b of the layered substrate 200. Receiving signal terminals Rx1, Rx2 are disposed on a bottom surface 200a of the layered substrate 200. The high frequency module 1 comprises signal paths SP1, SP2 connecting the output terminals T1, T2 and the receiving signal terminals Rx1, Rx2. The signal paths SP1, SP2 are configured using one or more through-holes provided within the layered substrate 200, respectively, and are not exposed on a side surface of the layered substrate 200. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008245083(A) 申请公布日期 2008.10.09
申请号 JP20070085122 申请日期 2007.03.28
申请人 TDK CORP 发明人 IWATA TADASHI
分类号 H04B1/44 主分类号 H04B1/44
代理机构 代理人
主权项
地址