发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board capable of achieving peeling prevention of an insulating resin layer and peeling prevention of through hole lands, when a press fit connecting terminal is inserted into a through hole. SOLUTION: In a printed wiring board, having laminated insulating layers 121, 122 and conductive layers 111 to 113, and a through hole into which press fit connecting terminals T (T1, T2, ...) are inserted, a plurality of through holes 130 (131, 132, ...), into which a plurality of press fit connecting terminals are inserted, are formed in a prescribed region of a printed wiring board, and a reinforcing layer 111 with thickness of 0.2 mm or larger is interposed inside of the insulating layer and between a plurality of through holes. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008244349(A) 申请公布日期 2008.10.09
申请号 JP20070085908 申请日期 2007.03.28
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KIHARA YASUSHI
分类号 H05K1/18;H01R9/16;H05K1/02 主分类号 H05K1/18
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