| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a semiconductor substrate, in relation to the method of processing the semiconductor substrate removing the resist formed on a circumferential part of the semiconductor substrate by a coating apparatus, wherein the method of processing a semiconductor substrate can prevent smearing of manufacturing apparatuses used in forming semiconductor integrated circuits on a semiconductor substrate, and can improve the yield of the semiconductor integrated circuits. SOLUTION: After the resist 30 formed on a circumferential part of a semiconductor substrate 27 is removed, photographs are imaged extending over the entire circumferential part of the semiconductor substrate 27 to obtain image data F, and the removed width W of the resist 30 is calculated based on the image data F. When the removed width W of the resist 30 is determined as being out of a predetermined range K, an abnormality alarm is issued. COPYRIGHT: (C)2009,JPO&INPIT
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