| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device and method, wherein an imperfect area is effectively inspected, thereby attempting to enhance a precision of a yield management. SOLUTION: The device includes: an illumination means 10 for irradiating an inspection light onto a wafer 1; a detection means 20 for detecting a scattered light from the wafer 1 to output an image signal; a coordinates manager 140 for storing arrangement information on each inspection area on the wafer 1; an image processor 120 for comparing the image signal of the inspection area detected by the detection means 20 with the image signal of a corresponding pixel of a reference area to detect a difference between the both, and also for recognizing an imperfect detection area reaching a wafer edge 1a based on the arrangement information on the inspection area, and for excluding the inspection data outside of the wafer edge 1a in the corresponding imperfect inspection area from effective data when the imperfect inspection area is inspected; and a contaminant determiner 130 for comparing a difference of the image signal of a corresponding pixel of the inspection area and the reference area with a threshold to determine whether a contaminant exists. COPYRIGHT: (C)2009,JPO&INPIT
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