| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate manufacturing method that forms protrusions without causing a deposited residue of a mold-releasing agent from a die by an embossing method so as to form a bump part of a wiring layer as an interlayer connection part. SOLUTION: The wiring substrate manufacturing method is composed as follows. Protrusions in a prescribed pattern are provided on the surface of a lower-layer insulating layer. A part of a wiring layer is extended on the protrusions so as to make it as a wiring-layer bump part. The top face of the wiring-layer bump part is exposed on the surface of an insulating layer formed on the wiring layer so as to make it as a joint. A conductive foil is laminated on a thermally-peeling sheet so as to form a conductor pattern in a form complementary to the prescribed pattern of the protrusions. The conductor pattern adhered to the thermally-peeling sheet is used as a shaping die so as to form an insulating layer on a wiring-substrate base material. Consequently, it is possible to form the protrusions in the prescribed pattern. The thermally-peeling sheet is peeled off by heating. The conductor pattern between the protrusions is removed by etching. A wiring layer is formed on the lower-layer insulating layer while an insulating layer is formed on the wiring layer. The surface of the insulating layer is polished so as to expose the top face of the wiring-layer bump part. COPYRIGHT: (C)2009,JPO&INPIT
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