| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus of high use efficiency of a target and a magnetron sputtering method. SOLUTION: In a vacuum chamber provided with a cathod electrode, a target is arranged on the surface of a cathode electrode and a substrate is arranged in a position opposite to the cathode electrode. And, a first annular magnet 305 is annularly arranged so as to surround a central part on the rear of the cathode electrode, a second annular magnet 307 is annularly arranged so as to surround the first annular magnet 305 and a third annular magnet 309 is annularly arranged so as to surround the second annular magnet 307. The first annular magnet 305 generates magnetic fields perpendicularly to the target. The second annular magnet 307 generates the magnetic fields in the same direction as that of the first annular magnet 305 to the target and a third annular magnet 307 generates the magnetic fields in the reverse direction as that of the second annular magnet 307. When a high voltage is applied between the target and the substrate, the deepest erosion is formed in the outer edge of the target. COPYRIGHT: (C)2009,JPO&INPIT
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