| 摘要 |
A spherical ball polishing method and a spherical ball polishing apparatus are provided to carry out a rough cut process and an accurate cut process at the same time by forming a polishing groove and a polishing area on an upper plate. A spherical ball polishing apparatus comprises an upper plate(1) and a lower plate(2). The upper plate includes an inlet(4), a polishing groove(5), a polishing area(11), and an edge(10). Balls(3) are inserted through the inlet. The polishing groove is in a spiral shape. The lower plate includes a polishing pad(9). An abrasive is adhered to the polishing groove, wherein the abrasive is made by mixing one or more among cerium oxide, silica, silicon cardide, alumina, tungsten carbide, and diamond particles. |
