| 摘要 |
PURPOSE:To easily perform the coupling and assembly of an optical fiber without sacrificing the light-receiving efficiency and the reception band by applying the emitted light from the optical fiber vertically to the light-receiving surface of a semiconductor photodetector. CONSTITUTION:A semiconductor photodetector 1 is constituted by integrating a PIN photo diode and a preamplifier on one chip and is mounted on the vertical end surface of a pattern substrate 2 comprising a conductor pattern formed on a ceramic. The substrate 2 is installed on a module case 5 and bias leads 3 and an output connector terminal 4 are soldered on the substrate 2. A fiber cord 8 is inserted in a fiber sleeve 7 attached on the left end surface of the case 5 and the point of a core wire (optical fiber) 6 in the fiber cord 8 is provided in such a way as to oppose to the photodetector 1. Thereby, if the surface of the point of the optical fiber is flatly formed, the positioning and coupling of the optical fiber can be easily performed.
|
