| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP pad conditioner capable of uniformly conditioning whole surface of the pad even in a polishing pad for the CMP having evenness on the surface, and capable of stably conditioning without generating chattering during conditioning even under high-load condition. <P>SOLUTION: A pad conditioner has a superabrasive grain layer formed by fixing a single layer of the superabrasive grains on the surface of a disc-shape metal base. The superabrasive grain layer is formed on the whole surface of a concentric annular shape area and a concentric circular shape area on the disc shape metal base. In the annular shape area, the intermediate neighborhood of the width in the radial direction is protruded, and the circular shape area is a protruded shape which is the highest on the central axis of the disc-shape metal base. As for the difference in height between tops, the top of the protruded part of the circular shape area is preferably made to be higher than the top of the protruded part of the annular shape area by 5 to 100 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
