| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate with a structure that allows a solder bump's height to be higher in the circuit substrate for flip-chip bonding a semiconductor chip. SOLUTION: The circuit substrate 1 onto which a semiconductor chip is flip-chip bonded has an electrode pad 3 formed on the surface of the substrate body 2 and a solder resist layer 4 covering the surface of the substrate body 2. An aperture 4a exposing the electrode pad 3 is formed onto the solder resist layer 4. Further, the substrate body 2 has a trench 2a prepared along the perimeter of the area where the electrode pad 3 is arranged, and this trench 2a is also exposed by the aperture 4a. COPYRIGHT: (C)2009,JPO&INPIT |
