发明名称 NON-LEAD BASED ALLOY JOINING MATERIAL, JOINING METHOD, AND JOINED BODY
摘要 PROBLEM TO BE SOLVED: To provide a new alloy joining material which is inexpensive and having general applicability, and which can be substitutes for the conventional Pb-containing high temperature based solder. SOLUTION: A first metallic material 1 to be joined and a second material 2 to be joined are stacked across a thin layer joining material 3 so as to form a stacked body 4. The thin layer joining material 3 is, e.g., sheet solder made of a non-lead based alloy joining material essentially composed of Te and Ag and comprising one or more kinds of elements selected from the group consisting of Sn, Zn and Co or a non-lead based alloy joining material essentially composed of Te and Ag and comprising one or more kinds of elements selected from the group consisting of Al, Ti, Ni, Au, Mg, Pt, Mn and Fe. By heating the stacked body 4 at a temperature in the range of 350 to 450°C, a joined body 6 joined across a joining layer 5 having high heat resistance can be obtained. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008238233(A) 申请公布日期 2008.10.09
申请号 JP20070084246 申请日期 2007.03.28
申请人 TOSHIBA CORP 发明人 TAKAHASHI TOSHIHIDE;KONO RYUKO
分类号 B23K35/28;B23K1/00;B23K35/22;B23K101/40;C22C28/00;H01L21/52;H01L23/36 主分类号 B23K35/28
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