| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate and a semiconductor device, having high packaging reliability which can relax the stresses applied to a solder junction part. SOLUTION: A semiconductor package substrate 1 has a first circuit conductor layer 2 electrically connected to a semiconductor element, a second circuit conductor layer 3 having a connection terminal for electrical connection to an external component, an insulating layer 5 provided in between first and second circuit conductor layers 2, 3 and a via 6 which passes through the insulating layer 5 and electrically connects the first circuit conductor layer 2 and the second circuit conductor layer 3. The insulating layer 5 has a two-layer structure, and Young's modulus of a second insulating layer 5b, provided to a second circuit conductor layer 3 side, is smaller than Young's modulus of a first insulating layer 5a provided to a first circuit conductor layer 2 side. COPYRIGHT: (C)2009,JPO&INPIT
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