| 摘要 |
PROBLEM TO BE SOLVED: To prevent a main substrate from being deformed by applying press force appropriate for canceling stress generated in the main substrate from a formation section to the main substrate. SOLUTION: A method of manufacturing a divided substrate includes a lamination process and a press process. In the lamination process, at least a resin substrate 67 is laminated on one surface of the main substrate 66, and a circuit board 62, where a resin layer 65 and a circuit component 63 are packaged at the side of the resin layer 65, is laminated on the other surface of the main substrate 66, thus forming a multilayer board 60. In the press process, presswork is performed by bringing a press die 4 having a formation section 4a comprising a projection in a shape corresponding to a three-dimensional shape section 6a in the divided substrate 6 into contact with a surface at the side of the resin substrate 67 in the multilayer board 60, thus forming the three-dimensional shape section 6a comprising a recess at the formation section 4a and burying the circuit component 63 into a prescribed region at least partially overlapping with the three-dimensional shape section 6a in the thickness direction of the main substrate 66 in the resin layer 65. A press die 4 is used that has the formation section 4a with the same height dimension h1 as a thickness dimension t1 in the resin substrate 67. COPYRIGHT: (C)2009,JPO&INPIT
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