发明名称 Cu-Ni-Sn-P BASED COPPER ALLOY SHEET AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a copper alloy sheet which is composed of a Cu-Ni-Sn-P based copper alloy and in which strength, bendability and stress relaxation resistance are simultaneously improved to high levels. SOLUTION: The copper alloy sheet is characterized by: having a composition consisting of, by mass, 0.1 to 5% Ni, 0.1 to 5% Sn, 0.01 to 0.5% P and the balance essentially Cu and further containing, if necessary, one or more kinds among≤3% Fe,≤5% Zn,≤1% Mg,≤1% Si and≤2% Co or further containing≤3%, in total, of one or more elements among Cr, B, Zr, Ti, Mn and V, the balance essentially Cu; and having a crystal orientation satisfying inequality Iä420}/I<SB>0</SB>ä420}>1.0 (where Iä420} is an X-ray diffraction intensity of ä420} crystal plane in the sheet surface of the copper alloy sheet and I<SB>0</SB>ä420} is an X-ray diffraction intensity of ä420} crystal plane of a standard powder of pure copper). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008231492(A) 申请公布日期 2008.10.02
申请号 JP20070071750 申请日期 2007.03.20
申请人 DOWA METALTECH KK 发明人 KO IRIN;SUDA HISASHI;NARUEDA HIROTO;SUGAWARA AKIRA
分类号 C22C9/02;C22C9/06;C22F1/00;C22F1/08;H01B5/02;H01B13/00;H01L23/48 主分类号 C22C9/02
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