| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer printed wiring board wherein centers of an upper hole and a lower hole of a step via are arranged at almost the same position, and to provide a method for manufacturing the board stably at a low cost, in a structure of the multi-layer printed wiring board containing a step via structure at an inter-layer connection part, and to provide its manufacturing method. SOLUTION: In the structure, an outer-layer build-up layer is laminated on an inner layer core substrate. A step via hole 23a for inter-layer connection of three or more wiring layers, where diameter of a conducting hole becomes larger going toward the outer side layer and a blind via hole 23b for inter-layer connection of only the outermost layer and the next lower wiring layer are provided to the printed wiring board for inter-layer connection of the inner layer core substrate and the outer layer build-up layer. In this printed wiring board and the method for manufacturing the same, the conductor thickness of a receiving land of the inner layer core substrate to the step via hole 23a is thinner than the conductor thickness of a receiving land of the blind via hole 23b. COPYRIGHT: (C)2009,JPO&INPIT |
