发明名称 SUBSTRATE TREATMENT EQUIPMENT AND METHOD OF CONTROLLING SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide substrate treatment equipment capable of easily coping with the case that a content of treatment in a treatment station is changed, and the method of controlling the substrate treatment equipment. SOLUTION: Substrate treatment equipment 100 comprises main chambers 11A-11F in which transfer robots 12A-12F are provided and a plurality of treatment stations 10A-10F comprising treatment chambers 15A-15F connected to the main chambers. In the substrate treatment equipment 100, a cluster recipe specifying treatment performed in a chronologic order in each of the plurality of treatment stations and an interface recipe specifying between which treatment stations out of the plurality of treatment stations the substrate is transferred are stored in a storage unit. The substrate is transferred to the plurality of treatment stations 10A-10F and the stations are made to sequentially perform the plurality of treatment based on the recipes. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008235512(A) 申请公布日期 2008.10.02
申请号 JP20070072018 申请日期 2007.03.20
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA HIDEAKI
分类号 H01L21/02 主分类号 H01L21/02
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