| 摘要 |
A wiring board including, on a resin insulating layer, an Ni-Cu alloy bonding seed layer constituted by 20 to 75 wt % of Ni and Cu to be a residual part and a wiring layer constituted by Cu formed thereon is provided. It is possible to manufacture the wiring board by (A) forming the Ni-Cu alloy bonding seed layer through a one-time treatment and removing an unnecessary portion through one-time etching after wiring patterning, or (B) forming the Ni-Cu alloy bonding seed layer and a Cu layer thereon and patterning thereof in a lump by etching. A wiring board in which a wiring layer is formed by an Ni-Cu alloy constituted by 20 to 75 wt % of Ni and Cu to be a residual part over a whole thickness of the wiring layer is also provided.
|
