发明名称 Fabrication system and fabrication method
摘要 A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
申请公布号 US2008243293(A1) 申请公布日期 2008.10.02
申请号 US20080153926 申请日期 2008.05.28
申请人 RENESAS TECHNOLOGY CORP. 发明人 YOKOYAMA NATSUKI;KAWAMOTO YOSHIFUMI;MURAKAMI EIICHI;UCHIDA FUMIHIKO;MIZUISHI KENICHI;KAWAMURA YOSHIO
分类号 B65G49/07;G06F17/00;B23Q41/00;B23Q41/02;C23C14/56;C23C16/54;G05B19/418;H01L21/00;H01L21/02;H01L21/027;H01L21/205;H01L21/285;H01L21/304;H01L21/3065;H01L21/3205;H01L21/677;H01L21/68 主分类号 B65G49/07
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