发明名称 |
Fabrication system and fabrication method |
摘要 |
A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
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申请公布号 |
US2008243293(A1) |
申请公布日期 |
2008.10.02 |
申请号 |
US20080153926 |
申请日期 |
2008.05.28 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
YOKOYAMA NATSUKI;KAWAMOTO YOSHIFUMI;MURAKAMI EIICHI;UCHIDA FUMIHIKO;MIZUISHI KENICHI;KAWAMURA YOSHIO |
分类号 |
B65G49/07;G06F17/00;B23Q41/00;B23Q41/02;C23C14/56;C23C16/54;G05B19/418;H01L21/00;H01L21/02;H01L21/027;H01L21/205;H01L21/285;H01L21/304;H01L21/3065;H01L21/3205;H01L21/677;H01L21/68 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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