| 摘要 |
A substrate processing apparatus and a substrate processing method are provided to improve a cleaning effect and to prevent damage of a substrate by causing a smooth flow of fluid around a plurality of chucking pins. A substrate(W) is loaded on a spin chuck(104). A plurality of chucking pins(120) are formed on an upper surface of the spin chuck to prevent the ejection of the substrate loaded on the spin chuck when the spin chuck is rotated. A driving unit(130) operates the chucking pins to chuck and dechuck the substrate loaded on the spin chuck. The chucking pins are divided into first and second chucking pins. A control unit(108) controls the driving unit to chuck alternately substrates by using the first and second chucking pins.
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