| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicone resin composition for encapsulating a light-emitting element, which can easily perform encapsulation by potting, can be easily molded into a lens-shaped (e.g., hemispherical or paraboloidal) object, can give a highly transparent lens-shaped encapsulation object when molded by potting. <P>SOLUTION: The silicone resin composition is a composition containing 2-25 wt.%, based on the total amount of the compounds (A) and (B), silica having an average particle diameter of 1-30 nm and having viscosity (23°C) of above 10 Pa s to below 70 Pa s and a thixotropic index of 2.0-5.5, and used for encapsulation by potting. The method for producing the photoconductor electronic component comprises molding the encapsulation resin to encapsulate a light-emitting-element-fitted substrate with a lens-shaped object by potting using the composition as the encapsulation resin. Here, the compound (A) is a liquid or solid organopolysiloxane having at least two alkenyl groups in one molecule, and the compound (B) is an organohydrogenpolysiloxane having at least two Si-H bonds in one molecule and/or an organohydrogensilane. <P>COPYRIGHT: (C)2009,JPO&INPIT |
