| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus to detect defects on the upper surface (6a), the edge surface (6b) and the lower surface (6c) in the edge portion of a wafer (6) by a simple method, and a defect image picking-up method. SOLUTION: The apparatus can evaluate defects in the edge region of the wafer (6) by a user, or can automatically. Particularly the apparatus comprises three cameras (25,26,27); each camera is equipped with an objective lens (30); the first camera (25) is disposed so as to face the upper edge region (6a) of the wafer (6); the second camera (26) is disposed so as to face the edge surface (6b) of the wafer (6); and the third camera is disposed so as to face the lower edge region (6c) of the wafer (6). COPYRIGHT: (C)2009,JPO&INPIT
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