| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module by which a substrate is smoothly reused without deteriorating connection reliability between the substrate and a new film wiring board, by leaving no anisotropic conductive adhesive agent between wiring patterns of the substrate, and to provide a method for manufacturing the semiconductor module. SOLUTION: The semiconductor module M is constituted, in such a way that a plurality of wiring patterns 2A formed on the substrate 1 at predetermined intervals and a plurality of wiring patterns 4A formed on the film wiring substrate 3 at predetermined intervals are electrically connected via the anisotropic conductive adhesive agent 5; further, the substrate can be reused by removing defective or unnecessary film wiring board from the substrate; the distance between the wiring patterns formed on the substrate is set at less than 20 times the diameter of particles which constitute an anisotropic conductive adhesive agent; the distance between the wiring patterns, formed on the film wiring board is set at about 300μm; and the wiring patterns of the substrate and that of the film wiring board are so formed as to have equal pitches. COPYRIGHT: (C)2009,JPO&INPIT
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