| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder reflow device which is superior in reliability of products and productivity. SOLUTION: The device has a heating part 30 which heats a substrate 2, while transferring it at a first transfer velocity, and a slow cooling part 60 which receives the heated substrate 2 and slowly cools the received substrate 2, while transferring it at a second transfer velocity slower than the first transfer velocity. The slow cooling part 60 has three carriers 60_1, 60_2, 60_3, which are arranged in a direction parallel to the transfer direction of the substrate 2 and transfer the mounted substrate 2 received from the heating part 30 at the second transfer velocity, a carrier support mechanism 80 supporting the three transfers and a support mechanism reciprocative device 90 which in circulating manner repeats an operation for moving one transfer device of the three transfer devices to a substrate-receiving position 82 for receiving the substrate 2 from the heating part 30, by reciprocating the carrier support mechanism 80. COPYRIGHT: (C)2009,JPO&INPIT |
