| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple chip semiconductor device wherein an external terminal is easily led out from a semiconductor chip to be master, when semiconductor chips of different sizes are stacked to connect, and enlargement of semiconductor device is prevented. SOLUTION: This device includes an interposer 20 which has an opening part 21, a plurality of electrode terminals 22 formed near the opening part 21, a plurality of electrode terminals 23 formed at the peripheral part of the interposer, and a plurality of interconnect lines 24 formed to electrically connect corresponding electrode terminals 22 and 23 to each other; a slave chip 30 on which a plurality of bump electrodes 31 are formed; and a master chip 10 which has a plurality of bump electrodes 11; including objects for external connection, and is so arranged that its front surface faces a front surface of the slave chip 30. In the master chip 10, a plurality of bump electrodes except for the objects for external connection out of the plurality of bump electrodes 11 are electrically connected to the plurality of bump electrodes 31 of the slave chip 30 in the opening part 21, and the plurality of bump electrodes 11 for external connection are electrically connected to the electrode terminals 23 of the interposer 20. COPYRIGHT: (C)2009,JPO&INPIT |
