| 摘要 |
PROBLEM TO BE SOLVED: To provide a machining method of a silicon wafer for cutting the silicon wafer along a break pattern and separating each silicon substrate well, and to provide a manufacturing process of a liquid ejection head. SOLUTION: When a thin portion 127 is formed, a correction pattern 140a covering a silicon wafer 126 at the edge of each acute angle portion 203 of a through hole 201 with a predetermined width is formed. Start of etching of the silicon wafer 126 is delayed at the edge of the acute angle portion 203 by performing anisotropic etching of the silicon wafer 126 through a mask pattern including the correction pattern 140a. COPYRIGHT: (C)2009,JPO&INPIT
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