SURFACE PROCESSING METHOD AND METHOD FOR PRODUCING RECORDING MEDIUM
摘要
<p>A method for processing the surface of a substrate comprising an arranging step for arranging a substrate in a vacuum chamber; a processing step for sputtering the surface of a substrate by applying a high frequency voltage to the substrate; a measuring step for measuring cathode drop potential occurring in the substrate during the processing step and obtaining the time integration value thereof; and a judging step for judging whether surface processing state of the substrate is good or not based on the time integration value obtained in the measuring step. Surface processing state of the substrate can be judged precisely by utilizing a fact that good correlation exists between the time integration value of cathode drop potential and the surface processing amount of the substrate.</p>