发明名称 SURFACE PROCESSING METHOD AND METHOD FOR PRODUCING RECORDING MEDIUM
摘要 <p>A method for processing the surface of a substrate comprising an arranging step for arranging a substrate in a vacuum chamber; a processing step for sputtering the surface of a substrate by applying a high frequency voltage to the substrate; a measuring step for measuring cathode drop potential occurring in the substrate during the processing step and obtaining the time integration value thereof; and a judging step for judging whether surface processing state of the substrate is good or not based on the time integration value obtained in the measuring step. Surface processing state of the substrate can be judged precisely by utilizing a fact that good correlation exists between the time integration value of cathode drop potential and the surface processing amount of the substrate.</p>
申请公布号 WO2008117439(A1) 申请公布日期 2008.10.02
申请号 WO2007JP56396 申请日期 2007.03.27
申请人 FUJITSU LIMITED;SATO, YOICHI;HORIGOME, SHIGERU;TAKIGUCHI, SATOSHI;TAKAMATSU, YASUTAKE;TAKAHASHI, KATSUNORI 发明人 SATO, YOICHI;HORIGOME, SHIGERU;TAKIGUCHI, SATOSHI;TAKAMATSU, YASUTAKE;TAKAHASHI, KATSUNORI
分类号 G11B5/84 主分类号 G11B5/84
代理机构 代理人
主权项
地址