发明名称 |
RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS |
摘要 |
Disclosed is resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal patterns can be suitably used in the formation of films for shielding electromagnetic waves. |
申请公布号 |
WO2007119966(A9) |
申请公布日期 |
2008.10.02 |
申请号 |
WO2007KR01779 |
申请日期 |
2007.04.12 |
申请人 |
LG CHEM, LTD.;KIM, MIN-KYOUN;KO, MIN-JIN;CHOI, BUM-GYU;LEE, SANG-CHUL;ROH, JEONG-IM |
发明人 |
KIM, MIN-KYOUN;KO, MIN-JIN;CHOI, BUM-GYU;LEE, SANG-CHUL;ROH, JEONG-IM |
分类号 |
C08F4/00;G03F7/027 |
主分类号 |
C08F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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