| 摘要 |
A lead frame for a semiconductor package is provided to prevent a wire bonding defect in case a width and an interval of an inner lead are smaller than a size of a ball by forming a pad section and a groove section on the inner lead of the lead frame. A lead frame(10) includes a die pad, inner leads(1), outer leads corresponding to the inner leads, and dam bars arranged between the inner leads and the outer leads. A semiconductor chip is attached to the die pad. The inner leads are arranged around the die pad. A pad section(6) is prepared on a part of each inner lead. The pad section is wider than a width of the inner lead. A concave groove section(8) is formed on the inner leads adjacent to the pad section in order to insulate the pad section from the inner leads adjacent to the pad section. The pad sections are arranged on the respective inner leads in a zigzag shape. An interval between the pad section and the groove section is constant. |
