| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of mounting component for eliminating filling failures of a sealing resin in a space between the mounting component and a wiring circuit board. SOLUTION: The mounting method of mounting component comprises the steps of arranging a mask 50 having an aperture located on a first external connecting terminal 1a on the wiring circuit board 1 having the first external connecting terminal 1a, forming a solder layer 10 including a spacer 10a on a first external connecting terminal 10a by filling the aperture of mask 50 with a solder paste 10 containing the spacer 10a, removing the mask 50, mounting a mounting component 2 to the wiring circuit board 1 with reflow of the solder layer 10 by locating a second external connecting terminal 2a of the mounting component 2 on the solder layer 10, and sealing the mounting component 2 mounted on the wiring circuit board 1 with a resin 20. COPYRIGHT: (C)2009,JPO&INPIT |
