| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip having a bump structure which facilitates the control of the amount of electrically conductive paste applied to bumps, to provide a high-reliability mounting structure which prevents a short circuit and secures electrical connection, and to provide a reliable IC card which can be readily mounted. SOLUTION: The semiconductor device has a plurality of bumps on its surface and has dummy bumps whose heights from the surface of a substrate are smaller than those of the bumps. COPYRIGHT: (C)2009,JPO&INPIT
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