| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity as compared with a method using a dispenser, and to coat a compound ball having a small diameter with a very small amount of paste stably. SOLUTION: First, the compound ball 5 is fixed to all electrodes 4 for connecting each electronic device on a lower substrate 1 where a plurality of electronic devices are formed. Then, a print mask 6 having an opening 61 at the positions of all fixed compound balls 5 is arranged so that the upper parts of all the compound balls 5 enter each opening 61 and the top is at a lower side than the upper surface of the print mask 6. Then, solder paste printing is performed, and solder paste 7 is stuck to the upper part of the compound ball 5. COPYRIGHT: (C)2009,JPO&INPIT
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