发明名称 |
Die backside wire bond technology for single or stacked die package |
摘要 |
Methods and apparatus to provide die backside connections are described. In one embodiment, the backside of a die is metallized and coupled to another die or a substrate. Other embodiments are also described.
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申请公布号 |
US2008237310(A1) |
申请公布日期 |
2008.10.02 |
申请号 |
US20070728534 |
申请日期 |
2007.03.26 |
申请人 |
PERIAMAN SHANGGAR;OOI KOOI CHI;CHEAH BOK ENG;CHEW YEN HSIANG |
发明人 |
PERIAMAN SHANGGAR;OOI KOOI CHI;CHEAH BOK ENG;CHEW YEN HSIANG |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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