| 摘要 |
Disclosed is a suction pad for a semiconductor package transfer device including a picker head installed on an upper portion of a main body and adapted to move, a holder installed on the picker head, and a suction pad fixed to a lower end of the holder and adapted to absorb a semi¬ conductor package by creating a vacuum. The suction pad includes a body unit fixed to the holder, and a suction unit formed on a lower end of the body unit and adapted to contact a surface of a semiconductor package and absorb the semiconductor package. The body unit and the suction unit have different colors. The body unit of the suction pad, which acts as the background of images during a marking inspection, has a color markedly contrasted with that of the molding portion of the semiconductor package. The suction unit of the suction pad, which is bordered by the lead during a lateral inspection, has a color markedly contrasted with that of the lead. This guarantees accurate results from both marking and lateral inspections. Furthermore, vision inspections are possible in the current position of the semiconductor package transfer devices, i.e. the unloading pickers, without lowering them during a marking inspection. This shortens the vision inspection time and increases the UPH. |
